PRODUCTS
SOLUTION
XINGHAN AI
Post-Packaging Test Solution for Power Semiconductor
● High Precision and Comprehensive Coverage: The test solution covers full-dimensional parameters from DC to dynamic, room temperature to high temperature, and performance to reliability, ensuring no testing blind spots.
● High Efficiency and Throughput: Adopting parallel testing technology and high-speed handlers, the test workflow is optimized to significantly improve mass production testing efficiency and reduce testing costs.
● High Reliability and Traceability: Strict reliability screening processes combined with complete MES data traceability provide customers with "zero-defect" quality assurance, especially meeting automotive-grade requirements.
● High Flexibility and Scalability: Modular design can quickly adapt to the testing needs of new-type power devices (such as SiC and GaN) and new packaging forms (such as modules and plastic packaging), protecting customers' investments.
● One-Stop Service: Offers end-to-end services including scheme design, equipment integration, software development, commissioning, personnel training, and technical support, helping customers quickly establish and optimize testing capabilities.
Keyword:
Technology and Process
The post-packaging test of power devices is a sophisticated and interconnected process, aiming to ensure that every delivered device meets the stringent requirements for electrical performance, reliability, and safety.
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Solution Introduction
This solution is an integrated test system comprising Automated Test Equipment (ATE), Automated Handler, High-Temperature Test Unit (Hot Chuck/Thermal Stream), and professional test software. Modularly configured to meet the testing requirements of various products such as IGBTs, MOSFETs, SiC/GaN devices, and power modules, it enables seamless transition from laboratory characteristic analysis to high-speed mass production testing.
Core Products
● Power Semiconductor Static Parameter Test System
● Power Semiconductor Dynamic Parameter Test System
● Power Module Cyclic Aging Test System
● High-Temperature Reverse Bias (HTRB) Aging Test System
● High-Temperature High-Humidity Dynamic Reverse Bias (H3TRB) Aging Test System
● High-Temperature Dynamic Gate Bias Aging Test System
Industrial Standard
● JEDEC Series Standards: JESD22 (Reliability Test Methods), JESD24 (Power Device Test Standards), JESD51 (Thermal Resistance Test Standards)
● AEC-Q101: Stress Test Standards for Automotive-Grade Power Semiconductors
● MIL-STD-750: Test Methods for Military Semiconductor Devices
● AQG324: Reliability Test Standards for Electronic Components in the Automotive Industry
● IEC60747-8: Semiconductor Devices - Discrete Devices - Part 8: Field-Effect Transistors
● IEC60747-9: Semiconductor Devices - Part 9: Discrete Devices — Insulated-Gate Bipolar Transistors (IGBTs)
● JEDEC JEP173: Test Method for Dynamic Resistance of GaN HEMTs
Keyword:
Customized service process
Contact Customer Service
Technical Communication
Design Proposal
Finalize The Plan
Start Production
Debugging Training
Delivery Acceptance
After-Sales Service
Component Equipment
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If you have already experienced our product, please let us know your true feelings. Your satisfaction is our driving force for progress, while your suggestions are our valuable asset for continuous improvement.
Contact Us
Add: Room 3513 World Trade Building No.686 Jiefang Ave Wuhan City China
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