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High-Temperature High-Humidity Dynamic Reverse Bias (H3TRB) Aging Test System
The High-Temperature High-Humidity Dynamic Reverse Bias (H3TRB) Aging Test System is specifically designed to simulate and accelerate the evaluation of reliability challenges faced by power semiconductor devices operating in humid environments. When temperature, humidity, and bias voltage coexist, they induce failure mechanisms unique to plastic-encapsulated devices: moisture penetrates through resin interfaces, causing electrolytic corrosion under the action of an electric field and leading to corrosion of metal leads; or it promotes the migration of impurity ions, resulting in increased leakage current and even short circuits.
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High-Temperature High-Humidity Dynamic Reverse Bias (H3TRB) Aging Test System
The High-Temperature High-Humidity Dynamic Reverse Bias (H3TRB) Aging Test System is specifically designed to simulate and accelerate the evaluation of reliability challenges faced by power semiconductor devices operating in humid environments. When temperature, humidity, and bias voltage coexist, they induce failure mechanisms unique to plastic-encapsulated devices: moisture penetrates through resin interfaces, causing electrolytic corrosion under the action of an electric field and leading to corrosion of metal leads; or it promotes the migration of impurity ions, resulting in increased leakage current and even short circuits.
Breaking through the limitation of traditional constant temperature and humidity chambers that only provide an environment without the ability to simultaneously apply precise electrical stress, this system deeply integrates a high-precision dual-pressure temperature and humidity control chamber with a high-isolation high-voltage bias power supply. Its innovatively designed sample stage and air duct system prevent condensation on the device surface under high-temperature and high-humidity conditions, thereby strictly complying with the "non-condensing" test requirements specified in standards such as JEDEC.
By applying this comprehensive stress for an extended period, the system can effectively screen out early failures such as poor packaging hermeticity, defects in chip passivation layers, or internal bonding interfaces susceptible to corrosion. It is a rigorous certification item that power devices in application fields such as new energy vehicles and outdoor photovoltaic inverters must pass.
● Severe Environment Simulation: Adopts dual-pressure method or steam humidification method to precisely control three key factors—temperature, humidity (85℃/85%RH to 130℃/85%RH), and bias voltage—with high accuracy in temperature and humidity control.
● Anti-Condensation Design: Unique preheating of the sample area and gradient temperature control design prevent condensation on the DUT (Device Under Test) surface during testing, ensuring the accuracy and repeatability of test conditions.
● Insulation Safety Monitoring: Integrates an insulation resistance test module and an optional partial discharge detection function, enabling monitoring of the degradation of the package's insulation performance during or between tests.
● Corrosive Gas Management: The chamber is made of corrosion-resistant materials and equipped with an exhaust gas purification interface to handle corrosive gases that may be released during testing.
● Multi-Stress Combination Programming: Supports programming of complex test profiles such as temperature-humidity ramps, periodic on/off of bias voltage, and multi-stage combined stress.
|
Item |
Parameters |
|
Temperature Range |
40℃ ~ 130℃ |
|
Humidity Range |
20%RH ~ 98%RH (non-condensing) |
|
Temperature and Humidity Control Accuracy |
±0.5℃ for temperature, ±2%RH for humidity |
|
Reverse Bias Voltage |
DC 0 ~ 2000V |
|
Lower Limit of Leakage Current Measurement |
100pA |
|
Test Capacity |
Standard 16 stations, expandable |
|
Inner Chamber Material |
Stainless steel with corrosion-resistant coating |
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Add: Room 3513 World Trade Building No.686 Jiefang Ave Wuhan City China
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